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*Slices de silicio de grado electrónico total: excluye obleas no pulidas y recuperadas;
Los envíos son solo para aplicaciones de semiconductores y no incluyen aplicaciones solares
硅晶圆是大多数半导体的基本材料 ， 是所有电子产品的重要部件。高度工程化的晶圆片直径可达12英寸 ， 可用作制造大多数半导体器件的衬底材料。
October 24, 2025
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October 24, 2025
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.